| Customization: | Available |
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| Certification: | CE |
| Maximum Cutting Thickness: | 15 mm |
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Serial number | project | unit | Laser Cutting | |
1. | Maximum processing size of glass | mm | 2440x3660 | |
2. | Single-blade processing glass thickness | mm | ≤19 | |
3. | Glass laser cutting speed | m/min | 7-25 (depending on glass thickness) | |
4. | Processing laser wavelength | nm | 1064 | |
5. | Processing laser power | W | 80W@20KHz@Burst5 | |
6. | Repetition frequency | KHz | 20-40 | |
7. | Pulse Energy | mJ | 4 | |
8. | Number of pulses | 5-6 | ||
9. | Power stability | < 0.5%@24 hours , rms | ||
10. | Laser pulse width | ps | ~15 | |
11. | Beam quality | M²≤ 1.3 | ||
12. | Operating humidity | <60%RH@25 ℃ | ||
13. | Cooling method | Water Cooling | ||
14. | Split laser type | Carbon dioxide laser | ||
15. | CO2Laser wavelength | 10.6 um | ||
16. | C02Laser power | 300W | ||
17. | Glass laser splitting comprehensive speed | m/min | 6-18 (depending on glass thickness) | |
18. | Environmental resistance | Storage temperature | ℃ | 20~35 |
19. | Operating temperature | ℃ | 22~30 | |
20. | Ambient humidity | <60% | ||
21. | dust | mg/m³ | <0.20 | |
22. | Oil mist | Not allowed | ||
23. | Electromagnetic environment | International secondary standard |